Beschreibung
3.5" SBC with 10nm 11th Gen. Intel® Tiger Lake-UP3 Core™ i7/i5/i3 and Celeron® on-board SoC with HDMI, DP, IDPM, triple 2.5 GbE LAN , USB 3.2 Gen 2, M.2, SATA 6Gb/s, COM, IAUDIO, 0°C ~60°C and RoHS
● Support Intel® Tiger Lake-UP3 Processors
Equipped with 11th Gen. Intel® Core™ i7/i5/i3, Celeron® UP3 processor, the KINO-TGL features high performance, and can handle multitasking efficiently.
● Support Intel® I225V 2.5GbE Network Controller
Two Gigabit RJ45 network ports are provided via Intel® I225V 2.5GbE network controller to achieve up to 2.5GbE network transmission rate.
● Support USB 3.2 Gen 1 / Gen 2 up to 10Gb/s
The design of the motherboard is based on USB 3.2 protocol. Four USB 3.2 Gen 2 (10Gb/s) are provided through external I/O for efficient data transfer rate. The WAFER-TGL also supports two internal USB 2.0 ports for additional wiring options.
● IEI-specific IDPM Interface
IEI uniquely designs a IDPM interface that can connect to display modules, enabling users to add LVDS/eDP/VGA display interface upon requirements
Spezifikation
- SOC
- 11th Gen. Intel® mobile Tiger Lake-UP3 SoC
- Intel® Core™ i7-1185G7E (up to 4.8GHz, quad-core, 12M Cache, TDP=28/15/12W)
- Intel® Core™ i5-1145G7E (up to 4.4GHz, quad-core, 8M Cache, TDP=28/15/12W)
- Intel® Core™ i3-1115G4E (up to 4.1GHz, quad-core, 6M Cache, TDP=28/15/12W)
- Intel® Celeron® 6305 (up to 1.8GHz, dual-core, 4M Cache, TDP=15W)
- BIOS
- AMI UEFI BIOS
- Memory
- 1 x 260-pin 3200 MHz DDR4 SO-DIMMs support up to 32 GB
- Graphics Engine
- Intel® Gen11 UHD Graphics
- Display Output
- Four Independent Displays
- 2 x HDMI 1.4 (up to 4096 x 2160@30Hz)
- 1 x DP 1.4 (up to 4096 x 2160 @60Hz)
- 1 x IEI IDPM 3040 slot (only for IEI eDP/LVDS/VGA module)
- Ethernet
- LAN1: Intel® I225V 2.5GbE
- LAN2: Intel® I225V 2.5GbE
- LAN3: Intel® I225V 2.5GbE
- External I/O
- 4 x USB 3.2 Gen 2 (10Gb/s)
- Internal I/O
- 1 x SATA 6Gb/s
- 2 x USB 2.0 pin header (P=2.0)
- 2 x RS-232/422/485 (2x5 pin, P=2.0)
- 1 x RS-232 (2x5 pin, P=2.0)
- I²C
- 1 x I²C (1x4 pin)
- Audio
- 1 x IAUDIO (2x5 pin) supporting IEI AC-KIT-888S kit
- Front Panel
- 1 x Power LED & HDD LED (1x6 pin P=2.0)
- 1 x Power button (1x2 pin P=2.0)
- 1 x Reset button (1x2 pin P=2.0)
- LAN LED
- 3 x LAN LED (1x2 pin)
- Expansion
- 1 x M.2 A key for Wi-Fi & BT (2230) (PCIe Gen3 x1/USB 2.0 signal)
- 1 x M.2 B key (3052/2042) w/ SIM holder (PCIe Gen3 x2/USB 2.0 signal)
- Digital I/O
- 1 x 12-bit digital I/O (2x7pin)
- TPM
- Intel® PTT (TPM 2.0)
- Fan Connector
- 1 x System fan connector (1x4 pin)
- Power Supply
- +12V DC input power (AT/ATX mode)
- Watchdog Timer
- Software Programmable support 1~255 sec. System reset
- Power Consumption
- TBD
- Operating Temperature
- 0°C ~ 60°C
- Storage Temperature
- -20°C ~ 70°C
- Operating Humidity
- 5% ~95%, non-condensing
- Dimension
- 146mm x 102mm
- Weight
- GW: 850g / NW: 350g
- Certification
- CE/FCC Compliant
Filterkriterien
- Technologien
- Intel Tiger Lake
- Formfaktor
- 3.5 Zoll
- Sockel
- (mit Prozessor)
- Prozessor
- Celeron
- Taktfrequenz
- 1.8GHz
- RAM Kapazität (Max)
- 32 GB
- Grafik Schnittstellen - HDMI
- 2
- Grafik Schnittstellen - DP
- 1
- Grafik Schnittstellen - iDP/eDP/MIPI DSI
- 1
- Steckplätze - M.2
- 2
- USB Gen. (Max)
- USB 3.2
- USB Ports
- 6
- Ethernet
- 2.5 Gigabit
- Ports RJ45
- 3
- Eingangsspannungsbereich
- Festspannung 12V DC
- Eingangsspannung
- 12V DC
- Hersteller
- IEI
- Status
- Standard
- Zollnummer
- 84733020
- WEEE Nummer
- DE 76344510
Packliste
- 1 x WAFER-TGL-U single board computer
- 1 x SATA with power cable kit
- 1 x Power cable for P4
- 1 x QIG